New systems enable precision materials engineering in high-aspect-ratio 3D logic and memory chip structuresCentris™ Spectral™ SiN ALD leverages ...

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FREMONT, Calif., June 20, 2023 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today introduced Coronus DX, the industry's first bevel deposition solution optimized to address key manufacturing ...

The semiconductor industry is one of the most advanced and complex in the world. The semiconductor industry relies on highly ...

In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage ...

A virtual DOE-based process sensitivity check was performed for two tiers of channel holes in a 3D NAND device. The channel hole tilt distance, twist angle, and their sensitivities to the visible area ...

FREMONT, Calif., Sept. 23, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

FREMONT, Calif., July 31, 2024 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo™ 3.0, the third ...

Micron this week announced that it had begun construction of a new advanced wafer fabrication facility in Singapore, which will take over 10 years to completely build and will cost about $24 billion.

The time for 3D NAND flash memory may have finally arrived. IHS, in its recent research report, notes that 3D NAND's share of the market will reach 49.8% in 2016 and 65.2% in 2017 -- an exponential ...