A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...
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Top Metal Wire Bending Machine Manufacturers Drive Automation and Precision in Global Metal Forming
DONGGUAN CITY, GUANGDONG PROVINCE, CHINA, February 10, 2026 /EINPresswire.com/ -- The global metal forming industry is ...
PHOENIX — LSI Logic Corp. has developed a form of wire bond packaging that places bonding pads directly on top of a chip's active I/O circuitry. The “Pad on I/O” approach enables significantly smaller ...
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