Applied Materials (NasdaqGS:AMAT) announced a major expansion of its product suite focused on next generation AI chip ...
CEO Andy Hsu will introduce new applications and variations for 3D NAND flash and 3D DRAM, including a new AI application called "Local Computing", drastically increasing AI chip performance to a new ...
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3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module
NEO Semiconductor is once again announcing a new technology that hopes to revolutionize the state of DRAM memory. Today, the company unveiled two new 3D X-DRAM cell designs, 1T1C and 3T0C. The ...
TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the ...
The Roundhill Memory ETF (CBOE:DRAM) launched on April 2, 2026 and has returned roughly 79% since inception, very nearly doubling investor capital in about seven weeks. That is the kind of performance ...
TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development of OCTRAM (Oxide-Semiconductor Channel Transistor DRAM), a new type of 4F 2 DRAM, ...
SAN JOSE, Calif., April 23, 2026 /PRNewswire/ -- NEO Semiconductor, a leading innovator in advanced AI and memory technologies, today announced successful proof-of-concept (POC) results for its 3D ...
Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But ...
TSMC is reported to be cutting production runs on its mature process nodes as a glut of older chips in the market is putting downward pricing pressure on DDR4. DRAM spot prices are experiencing a ...
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