At this week's HotChips 34 conference, Intel CEO Pat Gelsinger laid out his company's vision for the future, and a cornerstone of that vision is advanced packaging combining multiple chiplets. That's ...
Intel Corp. has unveiled a new transistor dielectric material that it says will boost performance and dramatically reduce current leakage in next-generation chips. The advancement could enable Intel ...
Intel Wednesday demonstrated its revolutionary three-dimensional (3-D) Tri-Gate transistor technology in a 22-nm microprocessor, code-named Ivy Bridge, that is already being used in prototype laptops, ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Intel has talked a lot about the density of its 14-nanometer chip manufacturing technology relative to competing technologies from rivals Samsung and TSMC . In particular, Intel will tell you that its ...
Intel is in production with several 65-nm processors now, creating an inventory of commercial microprocessor products that will begin shipping early next year. At the IEDM conference, Intel showed die ...
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