Sunnyvale, Calif.—Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to ...

Avid readers of Tom’s Hardware have read a lot about the upcoming HBM4 and GDDR6 memory technologies, but as neither is used on mass production devices, few of us get to see actual HBM4 and GDDR6 ...

Propelled by the boom in cell phones—in which they support new photography and music features—memory multichip packages (MCPs) are expected see a market that nearly doubles in units and revenue over ...

Your next smartphone purchase might come with a new type of memory, depending on the model and when you buy it. That is because Samsung has begun mass producing what it claims is the industry's ...

Posts from this topic will be added to your daily email digest and your homepage feed. And it may abandon desktop GPUs. And it may abandon desktop GPUs. is a senior editor and founding member of The ...

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Intel has released a new video showing off its advanced packaging technologies. The goal of the video seems to be to attract customers to its Intel Foundry Services (IFS) business by letting the world ...

South Korean semiconductor giant SK Hynix has announced a new type of high-bandwidth memory (HBM) for AI datacenters that improves heat dissipation by integrating a cooling layer within the memory ...

Micron Technology, Inc. has announced the shipment of qualification samples for the world’s first 1γ node-based low-power double data rate 5X (LPDDR5X) memory, aimed at enhancing AI applications in ...

Intel’s bold reversal: Razor Lake-AX will bring back on-package memory, a feature Intel previously dropped after its Lunar Lake CPUs. Targeting top rivals: The new design aims to compete with AMD’s ...

Use left and right arrow keys to seek audio. According to a new rumor, Intel plans to bring back on-package memory with its upcoming Razor Lake-AX processors, expected to launch sometime in 2028. This ...