More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...

A new technical paper titled “Analyzing Modern NVIDIA GPU cores” was published by Universitat Politècnica de Catalunya.

Unveiling GPU Bottlenecks in Large-Batch LLM Inference” was published by researchers at Barcelona Supercomputing Center, ...

A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...

A new technical paper titled “Synaptic and neural behaviours in a standard silicon transistor” was published by researchers ...

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

The chip industry is exploring multiple avenues for simplifying multi-die integration, but difficulties remain for optimizing ...

Semiconductor verification is changing to integrate AI with human expertise.

Number of designs that are late increases. Rapidly rising complexity is the leading cause, but tools, training, and workflows ...

Verifying the functionality of a full multi-chip system, including digital controllers, analog electrical, and photonic ...