A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to ...

Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.

Diversity of compute elements proliferates for inference, but the mix varies by application. With AI changing so fast, it’s a ...

Enabling EDA Flow Automation through Microservice-Based LLM Agents” was published by researchers at Duke University and ...

This article examines the system-level challenges in enabling seamless 1.6 Tbps port-level interoperability for ...

Programmable chip-to-chip photonic fabrics in multi-accelerator servers for ML” was published by researchers at Cornell ...

Is AI using too much power? Some people think so, and believe the easy gains in power reduction have already been made.